OTIS SPACEThermalCore
Integrated cooling assemblies for computing payloads
We are developing ThermalCore as an integrated assembly that carries heat from a computing payload to the spacecraft’s heat-rejection interface. The design brings together thermal hardware, sensing, and control for a defined payload and mission.
Intended applications
ThermalCore is intended for teams integrating processors and other high-power electronics into spacecraft. The first assembly will be scoped around one payload and a defined set of spacecraft interfaces.
Design scope
Payload heat collection
Collect heat at the payload interface and carry it through a defined path to the spacecraft’s cooling interface.
Mission-specific configuration
Include storage or switching where the operating profile justifies the additional mass, power, and complexity.
Integrated sensing and control
Monitor the assembly and coordinate its operating states through defined connections to the spacecraft.
Integration requirements
These inputs will determine the design and evaluation scope.
- Payload heat distribution, power profile, and allowable temperatures.
- Spacecraft heat-rejection capacity and orbital operating conditions.
- Available mass, volume, structural interfaces, and electrical connections.
- Integration schedule, verification responsibilities, and qualification requirements.
Development and evaluation
Planned subsystem development
Development will establish interface requirements, component compatibility, and a test plan for the complete heat path. Subsystem performance must be assessed with the spacecraft’s boundary conditions.
Capacity, mass, and operating limits will be defined through integrated testing. Component results alone do not establish the performance of the complete assembly.
Related products
Discuss ThermalCore with our team
Share your payload interfaces, mission conditions, and integration schedule.